Teardown: 7 Port Active USB3.2 Hub

Haven’t done a teardown in a while. Had a TP-Link UH700 7-port USB hub in my scrap pile(But it was working). It’s a 12V powered USB3 hub with 7 ports and Micro USB3 input. After a solid 15-minute struggle, I managed to pry it open – those clips were tough! Needed multiple spudgers for the job.

Coming to the internals, the star of the show is two RTS5411S USB3.2 Gen1 4-port Hub controllers(In the middle row) powering 7 ports with a 12MHz crystal. The 8th port is routed as an input to the second RTS5411S. Firmware configuration likely resides in 25Q40CT SPI serial NOR flash chips located on both sides of the PCB. A convenient soft latch button rests on the top left. The power section on the top right and middle contains a 12V input jack and step-down buck converter APW8720B to put 5V through to beefy N-channel MOSFETs CED3172 and a massive inductor at the output. This chip fuels downstream 5V supply and an adjustable 1117 LDO supports the 3.3V rail. Each of the 7 ports has a PTC fuse protection to avoid blowing up if one port draws more current. There is a single LED to show if a port is active and the good part is that LEDs are optically isolated with a cheapo(but effective) black foam. There seems to be space for 2 more USB2.0 charging ports on the right which I believe is for a different Hub model with the PCB. Use the same PCB and sell it as a 9-port device. More Profit.

What’s intriguing is that every port has a footprint for an ESD diode array, yet none of the 8 USB ports, including the input port, have been populated. This seems like a risky approach and a strict no-no in my books. My assumption is that TP-Link might have used these chips on the certification test board to pass tests but omitted them in production to cut BOM costs. Though against the rules, this is a practice I’ve seen before in consumer products from other companies too. These units are likely to struggle with ESD tests. Has anyone in low-humidity environments faced ESD problems with this model?

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Cool Tech: Ultrasonic Lens Cleaning

Ultrasonic Lens Cleaning

Was exploring a few options for a project and happened to run across a fascinating lens-cleaning tech from Texas Instruments. If you work in the imaging industry you would know that ensuring clear, dust-free camera lenses is crucial, especially in outdoor environments. Ultrasonic Lens Cleaning (ULC) technology uses precisely controlled, high-frequency vibrations to clean glass surfaces. Imagine automatically detecting and clearing raindrops from a car’s rear camera lens without any driver intervention on a rainy day!

So, how does it work? All objects have a natural frequency, and when energy is applied at that frequency, resonance occurs, causing intense vibrations. It uses small piezo transducers which can vibrate at the natural frequency of glass, silicon, or polycarbonate lenses, and can effectively blast off water, dirt, and contaminants from the surface. The overall solution consists of a DSP processor with built algos for auto-detection of the mass change on the lens(Still unclear how they do that, maybe strain gauges or piezo touch sensing?) and a Piezo-driver circuit. Think of it like a cylindrical piezo disc around your lens with a lens cover on top. The piezo can expand and compress to create micro-vibrations. These vibrations can heat and clear snow from the lens cover too.

A cool piece of tech. But I would think that it would need customized lens solutions for each camera system. Might not be a plug and play sort of system. Do check them out in case you find it interesting. They have some cool video demos worth seeing. Ultrasonic lens cleaning is a shout-worthy tech innovation!

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