Back To Basics: AntiPads

In PCB design, antipads might sound like a minor detail, but they’re crucial for ensuring signal integrity, especially in high-speed designs. Let’s break down today what antipads are and why they’re essential.

An antipad is a void (or clearance area or no-Copper region) around a via within a PCB inner layer. Its purpose is to prevent electrical connection between the via and the plane, except where it’s intentionally needed. Simple enough. For newbies who might not know, most PCB CAD software handles antipad sizing automatically. That’s why you don’t get a short on the inner layers when a via passes from the top to the bottom. It has a pull-back region defined already. They are usually round and are defined by a diameter larger than the via pad diameter. But in some cases, folks do use oval-shaped antipads.

One key factor to keep in mind is not to make anti pad diameter very small. There are 2 issues I see with it, one is drill wandering, meaning if for some reason your via drill is slightly offset from the actual drill center, you can touch the plane before when plating happens and a short can happen in production. Another case is when you do backdrilling(Will do a detailed post on this in the future) to remove a via stub. For back drilling, manufacturers usually use a larger drill than standard drill holes so the chances of colliding with the planes while drilling are higher. So talk to the PCB manufacturer for your tolerances.

Another consideration is that an antipad should be designed such that it maintains the impedance of a transmission line when moving across the layers. This becomes critical in high-speed designs. There are field solvers and some direct analytical equations to get the exact anti-pad diameters. Search online to find them. Another issue I have seen is when a bunch of signals(think parallel buses) change layers, relatively close to each other. you will have multiple antipads in the return plane close by without clearance, effectively becoming a slot in the return plane(Return planes are ideally unbroken). Take care to prevent that while routing.

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Cool Tech (Literally!)

If you’ve been keeping an eye on the cooling and thermal solutions space recently, you might have noticed a significant shift in the last year. A new tech is emerging that could eventually replace traditional cooling fans, working in tandem with vapor chambers (check my previous posts for more on that) and heat pipes. The key player driving this innovation is Frore Systems, which introduced its ultra-thin (just 2.5mm high) cooling solution last year at CES. Let’s dive into the tech behind it.

From what I’ve gathered through patents and videos, this technology revolves around active piezoelectric coolers. Piezoelectric materials have a unique property: they can deform or move when an alternating voltage is applied. They ingeniously leveraged this by creating a mechanical system where many tiny piezoelectric elements move in unison to generate airflow. Essentially, it’s a piezoelectric microelectromechanical (MEMS) system.

Why is this exciting? These MEMS devices can be produced using standard IC fabrication methods, meaning they can be scaled up for mass production. In terms of specs, they can generate nearly 1700Pa of static pressure, which allows them to push air through very small spaces at high speeds on an ultra-thin profile and even through filter membranes(Which means no dust in laptops!). There are already videos out there showing how laptops and phones retrofitted with these units achieve better cooling with virtually no additional noise. It’s easy to see how this could become the new standard for cooling consumer electronics.

I’m writing about this now because just last week, a new competitor entered the market: xMEMS Labs. They’ve demonstrated a 1mm-thick chip capable of cooling, likely using similar principles. However, xMEMS appears to be leveraging MEMS speaker technology to move air directly over the chip. Imagine a speaker displacing air at ultra-high frequencies beyond the audible range – this could be connected in parallel across a surface to achieve similar cooling effects. Read up more on them. I need to stop because of character count limitations.

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