Tech Explained: Single vs Dual Cell Phone Batteries & Charging

Fast Charging is a rage these days on mobile phones with companies claiming mad charging rates of nearly 240W. How do they pump this amount of power into batteries?

Most consumer phones that you see out in the wild will be a single-cell type mostly a variation of Lithium based battery as it packs the highest energy density. The battery’s nominal voltage will be in the range of 3.5V to 3.8V depending on the type of chemistry of the cell. The battery capacities can range from 3500mAh-6000mAh. Batteries can be charged at only certain current rates at a voltage slightly above nominal voltages. A higher charging current means more heat. Heat is something really bad for batteries. So phone designers cannot keep increasing the charging current on batteries with a single cell. So what’s the workaround here? Dual Cell batteries…

These are multiple cells wired in series or parallel. Now for series cells, the overall battery voltage is higher so effectively you can charge the cell at a higher voltage and a lower current to reduce your current ratings and losses. Now in series configuration, the internal battery resistance does add up to give a bit more loss. In the parallel config, the voltage remains the same, but you can drastically increase the current as you have 2 parallel paths for currents going into each cell. You can even have 2 separate charging circuits and can effectively double the charging speed by charging both cells simultaneously but this is rarely practiced as it is expensive for the circuit’s POV. For charging wattage claimed over 120W, you usually see a dual-cell setup.

While dual-cell batteries charge faster, they need advanced systems for balanced charging and discharging. They also occupy more space than single cells of the same capacity. So as with anything in life, it’s always a balancing game for a design engineer. An ideal goal is always to determine what power I can pump into the battery maintaining a reasonably small temperature rise. That’s the beauty of engineering!

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BackToBasics: Wire Bonding in PCBs

You would have seen those black blobs in PCBs in those cheap mass-manufactured toys. It’s called a Chip on Board(COB).

COBs are placed on the PCBs via Wire Bonding. Wire bonding is a solid-phase welding process that joins a thin wire and pad surface. Now a COB is usually a chip with just the bare silicon die with exposed metal pads. This means that the plastic packaging that you find in most ICs which makes it a packaging style of QFN, TFQP, etc is missing. The metal pads on the die are connected via wire bonding directly to the PCB pads. Pour some black epoxy for strength and there you have a full COB on a PCB. It always need not be black epoxy, for SMD RGB LEDs if you look carefully you will see wire bonding used to connect the die to the package, and then the clear epoxy is poured to act as a lens to focus light.

Wire bonding can be done using Gold, Copper, or Aluminium wires based on requirements with Gold having good conductivity, resistance to oxidation, and good malleability to create strong bonds. But they are expensive. Copper or Aluminium is used when price is a concern. The wires are extremely thin with diameters in 10s of micrometers. To bond the wire on the pad you have different techniques like thermocompression bonding(using high heat and pressure to bond), ultrasonic bonding(Ultrasonic vibration to excite the spot to bond), or thermosonic(which is a combination of the above two methods).

Now Why wirebond on PCBs? Why not just use the chip as it is with the plastic package and solder it? The answer lies in the cost. For extremely large volume manufacturing, you can get the manufacturer to just give you the bare dies at a much cheaper cost than that with a package. Now wirebonding + die is cheaper than having a package. This is the reason why you see them a lot in dirt-cheap products. Another reason is that the actual die is usually much smaller than the plastic package, so for extremely small products it makes sense to do die + wirebonding to save a few mm of space in the PCB area.

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