Cool Tech (Literally!)

If you’ve been keeping an eye on the cooling and thermal solutions space recently, you might have noticed a significant shift in the last year. A new tech is emerging that could eventually replace traditional cooling fans, working in tandem with vapor chambers (check my previous posts for more on that) and heat pipes. The key player driving this innovation is Frore Systems, which introduced its ultra-thin (just 2.5mm high) cooling solution last year at CES. Let’s dive into the tech behind it.

From what I’ve gathered through patents and videos, this technology revolves around active piezoelectric coolers. Piezoelectric materials have a unique property: they can deform or move when an alternating voltage is applied. They ingeniously leveraged this by creating a mechanical system where many tiny piezoelectric elements move in unison to generate airflow. Essentially, it’s a piezoelectric microelectromechanical (MEMS) system.

Why is this exciting? These MEMS devices can be produced using standard IC fabrication methods, meaning they can be scaled up for mass production. In terms of specs, they can generate nearly 1700Pa of static pressure, which allows them to push air through very small spaces at high speeds on an ultra-thin profile and even through filter membranes(Which means no dust in laptops!). There are already videos out there showing how laptops and phones retrofitted with these units achieve better cooling with virtually no additional noise. It’s easy to see how this could become the new standard for cooling consumer electronics.

I’m writing about this now because just last week, a new competitor entered the market: xMEMS Labs. They’ve demonstrated a 1mm-thick chip capable of cooling, likely using similar principles. However, xMEMS appears to be leveraging MEMS speaker technology to move air directly over the chip. Imagine a speaker displacing air at ultra-high frequencies beyond the audible range – this could be connected in parallel across a surface to achieve similar cooling effects. Read up more on them. I need to stop because of character count limitations.

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Back To Basics: I3C

I3C is one of the newer standards in the wired domain and yes, the name is deliberately similar to I2C. It’s called “Improved Inter-Integrated Circuit”. Developed by the MIPI Alliance as an evolution of the older I2C protocol, it addresses some of the limitations of I2C, like its restricted speed. Just a heads-up: it’s pronounced ‘eye-three-see,’ not “eye-cubed-see,” unlike how I2C is pronounced “eye-squared-see.”


I3C still uses the familiar two-wire interface (SDA and SCL) but has enhanced features. SDA carries data and SCL the clock. I3C introduces dynamic address assignment, where devices can be automatically assigned addresses without manual configuration. Additionally, it supports hot-join, allowing devices to join the bus after initialization without disrupting communication which is a big feature upgrade from I2C. In-Band-Interrupts is a new feature that allows the slave devices to generate interrupts without requiring an external signal. In I2C master usually polls the slaves for info or the slave pings the master via a separate line. I3C can theoretically now reach a speed of 33Mbps compared to 3Mbps in the latest I2C HS mode which is coming close to the SPI realm of things. I3C handles this by reducing the bus capacitance limit to 50pF from 400pF on I2C. It supports lower voltage levels like 1.2V and 1.8V. Also, you don’t need external resistors as it’s built-in.

Why does it matter? The new protocol provides a standardized method for connecting multiple sensors to an SoC using just two lines. Imagine IoT sensors all utilizing a common 2-line protocol – it greatly simplifies layout and connections. It’s designed to address the need for higher speeds in connecting multiple sensors within mobile devices. I3C offers a future-proof solution that retains the simplicity of I2C while enhancing performance.

It’s still early days for this protocol. Currently, only a limited number of SoCs and sensor modules support it. I expect a gradual adoption over the next few years. Personally, I wouldn’t recommend using it in projects unless there’s a compelling reason to do so.

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