Advanced: Embedded PCB Components

Based on a Reddit question, I thought I should address the topic of Embedded components on PCBs. In its simplest form, embedding components is the process of taking any parts like capacitors, resistors, or active ICs which you might place on the top and bottom layers to the inner layers of your PCB. This means that the components are not visible anymore on the outside and you introduce a vertical stacking as a capability.

Embedded PCBs

Why do we need this? One of the primary reasons for using embedded components is to achieve miniaturization. With device sizes shrinking all the time embedding components inside PCBs enables designers to optimize space utilization and reduce the overall footprint. You can potentially reduce the PCB sizes by a factor of 30-70% going with this tech. By placing components very close, the parasitic effects, such as inductance and capacitance, can be minimized, leading to enhanced signal integrity and reduced electromagnetic interference. The components are shielded and sealed within the layers, safeguarding them against moisture, dust, and mechanical stresses making them suitable for harsh operating conditions. For thermal heat dissipation, since it’s sandwiched on all sides, thermal dissipation can also be better.

Embedded PCBs

There are different techniques for manufacturing a board like this. First, you go about choosing the components which will go inside based on the component heights. Components with larger thicknesses are not preferred on the inside. Manufacturing starts with the inner layers and placement of these parts via the normal soldering reflow process, then outer prepreg and resin layers are cut out via laser etching based on the component contours to fit the thickness. Now when they are heated, the resin flows over the components and creates a very strong bond.

The major drawback is cost and eventual repairability is non-existent. Altium and Allegro PCB softwares support embedding components with good mechanical integration and export. There is a good design rule guide worth exploring from Wurth Elektronik on how to go about designing embedded component boards.

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Back to Basics: Heat Pipes

Heat Pipes

Most circuit designers would have used heatsinks in their circuits to dissipate heat generated by Regulators, MOSFETs, Drivers, etc. Heatsinks are used to dissipate heat to the surroundings whereas heat pipes are designed to transfer heat from one region to the other where cooling can take place. It is used in spaces where there is not enough space to have a large area of heatsink right next to the heat source. You would probably have seen them as closed copper-coloured tubes on processor heatsinks or inside laptops.

At their most basic level, heat pipes are simply sealed tubes filled with a liquid that is designed to absorb and transport heat. When one end of the heat pipe is exposed to a heat source, the liquid inside the tube absorbs the heat and evaporates into a gas. This gas then travels down the length of the tube to a cooler area, where it condenses back into a liquid and releases the heat it has absorbed(Via a heat sink or fan or any cooling mechanism). The liquid then flows back to the hot end of the tube by a wick. What makes them extremely good is that they have a very large(at least 10x) thermal conductivity than that of a pure metal block like Copper or Aluminium because the liquid inside can change to vapor and carry heat faster. They rely on evaporation on one side and condensation on the other side. They can also operate over long distances, allowing heat to be transferred away from critical components to a remote location.

Power Transfer Heat Pipe

Heatpipes do come with a drawback, since it relies on fluid moving from a colder section to a hotter section in the liquid phase via wicking, their performance of heat transfer drops significantly if it’s made to work against gravity. If you see the charts you will find that how heat transfer properties fall as you change the orientation angles. So, when using heatpipes, it’s important to consider the orientation of the product to maximize heat transfer

For more Recommended Reading: Wakefield Thermal Design guide, ACT Cooling & Celsiainc website

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