Tech News: EU Cyber Resiliency Act(CRA)

Came across the European Union law which will impact any products you plan to manufacture and sell in EU. I have tried to summarize whatever I have understood below.

CRA is an EU law for products with digital elements. If you ship hardware with firmware into the EU, you’re in scope. It entered into force in Dec 2024. Reporting starts on Sep 2026. Most requirements apply from Dec 2027. Cybersecurity becomes part of CE. It will be mandatory for your product to be “CE” compliant.

If you are building a product, then you are mandated to do a cybersecurity risk assessment and build to it. You would have to keep an update path that can push security patches quickly and, by default, automatically with an opt-out if users wish to. You should provide security updates free of charge during your support period. Support periods are to be around 5yrs for consumer gear (Unless expected usage time is shorter) and longer for industrial. Your technical file must prove all of this for CE.

For hardware teams, the first practical step is to map your device to the CRA lists. Annex III in the bill names important product categories. If you make routers or modems, operating systems on devices, microcontrollers or FPGAs with security functions, or smart home locks and cameras, you likely sit in Class I. Firewalls and tamper-resistant microcontrollers fall into Class II. Class II expects a third-party assessment path such as EU-type examination plus production control. If it’s not in any of these, you can do self assessment. Read the document properly.

There is some leniency for FOSS non-commercial projects or if your product is in alpha/beta prototype stage.

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Tech News: 47µF on 0402

I found this while browsing the interwebs and thought it’s cool enough to do a small post. It’s a reasonably big deal, no-one seems to be discussing much on.

When selecting decoupling capacitors, you would ideally want to have the largest capacitor value in the smallest form factor to keep ESL/ESR in check. Capacitor manufacturer Murata claims that they have started the production of 47µF capacitors on a 0402 form factor(1mm x 0.5mm) design. Usually you don’t get these very large capacitor values in these small sizes. I am also hearing that, Samsung and Kyocera also have made the same 47µF in the 0402, but they in early R&D and production slated to start later this year.Previous largest in the same size was 22µF.
Why this matters is cap placement. 0402 lets you put serious capacitance values right next to power pins and BGA breakouts, which cuts loop inductance drastically. This means the Power Delivery Network is stable with these capacitors acting as the local energy reservoirs. Expect roughly 60% less mounting area than a 47µF 0603 part. This means you can have multiple of these caps in the same area. Meaning in phones, wearables, and AI server boards, around VRMs and GPU substrates, tighter placement can replace a chunk of mid-bulk caps and reduce the number of vias to ground. 
Murata caps seem to be X5R Class-II type with a rated voltage of 2.5V. So these are good for only 0.7 – 1.8 V rails. But the problem can be the DC bias. At the actual full DC voltage, capacitor value will be much lower as it’s a Class-II ceramic material. I tried to see if there are charts on Murata Simsurf tool, but they don’t seem to list these latest caps. So we need to wait till those are available for the general public.

But this is a good sign anyway. We will have the possibility of much bigger capacity caps for strong decoupling pretty soon. Keep a lookout for these in the future board designs.
Part Numbers: GRM158R60E476ME01D, CL05X476MS6N9W

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